During the Q2 earnings conference call held on July 31, Samsung Electronics reported that their high-bandwidth memory (HBM) sales volume increased by 30% in terms of bits compared to the previous quarter. The share of HBM3E (5th generation) within their total HBM sales expanded to the high 80% range. The company aims to normalize its HBM business and plans to significantly boost HBM3E sales in the second half of the year compared to the first half, while continuing to secure demand by completing mass production approvals for each client.
Furthermore, Samsung anticipates that the share of HBM3E in their sales will exceed the high 90% range. Regarding the 6th generation HBM4, they have completed mass production approval for the 10-nanometer class DRAM 1c process, and based on this, they have finished developing HBM4 products and have already shipped samples to major clients. The company mentioned that they have significantly improved performance and energy efficiency compared to HBM3E by applying advanced logic processes to the base die of HBM4 and optimizing its design. Samsung plans to ramp up supply in time for the full-scale demand for HBM4 expected in 2026, and they are continuously investing to expand 1c nano capacity to meet these needs.