Written by 11:31 AM Economics

SK Hynix begins mass production of 192GB SOCAMM2, optimized for NVIDIA’s ‘Vera Rubin’.

[Digital Daily Reporter, Go Sung-hyun] SK Hynix is set to begin mass production of the SOCAMM2 192GB, a next-generation AI server memory module standard.

On the 20th, SK Hynix announced that it would start mass production of the 10-nanometer class 6th generation (1c) LPDDR5X-based SOCAMM2 192GB.

SOCAMM2 is a module that modifies the LPDDR used in smartphones to fit server environments. It is characterized by its thin thickness and high scalability. It applies a press-fit connector structure to enhance signal integrity, making module replacement easy.

The primary use case is for CPU trays used in AI infrastructure. It replaces the RDIMM slots, which traditionally used DDR standards, allowing the use of low-power DDR (LPDDR) and is praised for its power efficiency. It also enhances space efficiency compared to RDIMM slots and is detachable, significantly improving flexibility in terms of capacity and replacement.

SK Hynix claims that the product achieves more than double the bandwidth and over 75% improved energy efficiency compared to existing server RDIMMs. This enhances data processing speeds and power efficiency needed for high-performance AI computations.

Additionally, the SOCAMM2 module is optimized for NVIDIA’s next-generation platform, ‘Vera Rubin’. This is expected to alleviate memory bottlenecks occurring during the training and inference processes of colossal AI models dealing with hundreds of billions of parameters, thereby increasing the overall system processing speed.

With the recent rapid shift in the AI market from learning-centric to inference-centric operations, the demand for high-efficiency, low-power memory is surging. SK Hynix has accelerated the stabilization of its mass production system in response to the needs of global cloud service providers (CSPs).

Kim Joo-sun, Head of AI Infrastructure at SK Hynix, stated, “By supplying the SOCAMM2 192GB, we set a new standard for AI memory performance,” adding, “We will position ourselves as a trustworthy AI memory solution company by strengthening cooperation with global customers.”

Kim Joo-seon, Chief Marketing Officer (CMO) of AI Infra at SK Hynix, commented, “The supply of the SOCAMM2 192GB product set a new standard for AI memory performance,” and “We aim to establish ourselves as the most trusted AI memory solution company through close collaboration with global AI clients.”

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