[‘\n’, TrendForce: “HBM Demand Growth Rate This Year Approaching 200%”,
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Share of high-bandwidth memory (HBM) in total DRAM bit capacity from 2023 to 2025. Provided by TrendForce, ‘It has been suggested that the price of high-bandwidth memory (HBM) will rise by 5-10% next year, accounting for over 30% of total DRAM revenue.’,
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, ‘On the 7th, Taiwanese market research firm TrendForce predicted that the share of HBM in total DRAM bit capacity would rise from 2% last year to over 5% this year, and is expected to exceed 10% next year.’,
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, ‘From the market value (revenue) perspective, the share of HBM increased from 8% of total DRAM revenue last year to 21% this year, and it is expected to exceed 30% by 2025. Especially with the expansion of the artificial intelligence (AI) market, the demand growth rate for HBM this year is approaching 200%, and it is expected to double next year.’,
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, ‘TrendForce stated, “The selling price of HBM is several times higher than that of traditional DRAM and about 5 times higher than that of DDR5,” and highlighted, “Such pricing, combined with AI chip technology that increases the single-device HBM capacity, will significantly increase the market share of HBM in terms of both capacity and market value in the DRAM market.”‘,
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, ‘TrendForce also explained, “Price negotiations for HBM in 2025 have already begun in the second quarter of this year,” and added, “Due to the limited overall production capacity of DRAM, suppliers have raised prices by 5-10%, impacting HBM2E, HBM3, and HBM3E.” TrendForce explained that buyers of HBM are willing to accept continued price increases with high confidence in AI demand forecasts. Additionally, the relatively low silicon through-silicon via (TSV) yield of HBM3E, currently ranging from 40-60%, leaves room for improvement and also has an impact.’,
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, ‘According to TrendForce’s analysis, since not all major supply companies have passed HBM3E customer certification, buyers seem to have accepted higher prices to secure stable and high-quality supply. TrendForce noted, “The price per Gb (gigabit) in the future may vary depending on the reliability and supply capabilities of DRAM suppliers, leading to an imbalance in the average selling price (ASP) and ultimately affecting profitability.”‘,
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, ‘From the perspective of major AI solution providers next year, TrendForce forecasts a significant shift in HBM specifications to HBM3E and an increase in 12-stacked products. TrendForce stated, “Such changes will increase the capacity of HBM per chip.”‘, ‘\n\t\t’]