Tomorrow Technology Develops AI Semiconductor Packaging Materials with Denka
(Daejeon=Yonhap News) Reporter Park Joo-young – The Korea Atomic Energy Research Institute announced on the 17th that Tomorrow Technology, a startup founded by the institute, has successfully secured investments from Japan’s leading materials company, Denka.
This investment was conducted using a corporate venture capital fund managed by Denka through Pegasus Tech Ventures, a Silicon Valley-based investment firm.
The research institute explained that it is difficult to disclose the scale of the investment.
Tomorrow Technology is a spin-off company from the research institute that possesses production technology for boron nitride nanotubes (BNNT), which are gaining attention as next-generation nanomaterials. The company has secured the world’s first industrial-scale mass production technology for BNNT in tons.
These materials excel in thermal conductivity, elasticity, strength, thermal and chemical stability, and space radiation shielding performance, making them applicable in various fields such as semiconductors, electronic components, energy, aerospace, and biotechnology.
Denka’s investment in Tomorrow Technology demonstrates the global recognition of the latter’s BNNT production technology.
Denka plans to collaborate with Tomorrow Technology to develop BNNT-based thermal conductive fillers and semiconductor packaging materials for artificial intelligence (AI) applications.
Kim Jae-woo, CEO of Tomorrow Technology, stated, “It is significant that the BNNT source technology developed with domestic expertise has been recognized for its productivity and quality by a major Japanese company, a leader in materials. We aim to grow into a global leader in next-generation semiconductor packaging materials for AI through strategic cooperation with Denka.”