Supply of Advanced FC-BGA Boards to AMD
Solving Warping Issue in Process with Innovative Technology,
Samsung Electro-Mechanics’ FC-BGA board. Photo provided by Samsung Electro-Mechanics,
, ‘[Seoul Economy]’,
,
, Samsung Electro-Mechanics (009150), ‘ announced on the 22nd that it will supply high-performance boards used in AMD’s data center semiconductors.’,
,
, ‘In this collaboration, Samsung Electro-Mechanics and AMD implemented high-level technology of placing multiple semiconductors on flip chip-ball grid array (FC-BGA) boards. Semiconductor boards are parts attached under the chip to help smooth connection between semiconductor and electronic devices. These boards are built by stacking multiple thin layers around the core layer at the center.’,
,
, ‘Today’s data center boards need to accommodate not only processing units but also high-bandwidth memory (HBM) and various chips on a single board. Compared to regular computer boards, these boards need to be 10 times larger in area and have three times more thin films, making it difficult to increase production yield with larger surface areas and height of layers.’,
,
, ‘Samsung Electro-Mechanics innovatively resolved the warping issue in the process to secure high yield rates. Samsung Electro-Mechanics’ board production line ensures real-time data collection and modeling functions to guarantee signal, power, and mechanical accuracy.’,
,
, ‘According to market research firm Prismark, the semiconductor board market is expected to grow at an average annual rate of about 7%, from 15.2 trillion won in 2024 to 20 trillion won in 2028. Samsung Electro-Mechanics has invested 1.9 trillion won to secure the industry’s leading technology for FC-BGA boards. Kim Won-taek, Vice President of Samsung Electro-Mechanics, stated, “Through continuous investment in advanced board solutions, we will provide core value to customers like AMD in the future.”‘,
,
,