[Digital Daily, reporter Go Seong-hyeon] Hanmi Semiconductor (CEO Kwak Dong-shin) announced on the 16th that it will participate in the ‘2025 SEMICON Southeast Asia (SEA / Southeast Asia)’ exhibition, which will be held from May 20 to 22 at the Sands Expo & Convention Centre in Singapore.
SEMICON is the largest global semiconductor industry exhibition organized by the International Semiconductor Equipment and Materials Association (SEMI). It is held annually in various regions and showcases the latest semiconductor technologies, equipment, materials, and related solutions. SEMICON SEA has traditionally been held in Malaysia but will take place in Singapore, the center of Southeast Asia, for its 30th anniversary this year. Hanmi Semiconductor has participated as an official sponsor in SEMICON Korea, SEMICON China, and SEMICON Taiwan annually, but this is their first participation in SEMICON SEA.
At this exhibition, Hanmi Semiconductor will focus on introducing their TC bonder for HBM production, which holds the number one global market share. The Hanmi Semiconductor TC Bonder 1.0 Griffin SB (TC BONDER 1.0 GRIFFIN SB) is used for the production of cutting-edge high-bandwidth memory HBM3E in 8-layer and 12-layer configurations. Hanmi Semiconductor holds more than 90% market share in the advanced HBM3E market.
The company also plans to actively promote its seventh-generation singularization equipment, ‘Micro Saw & Vision Placement 6.0 Griffin’ (micro SAW & VISION PLACEMENT 6.0 GRIFFIN), which has enhanced precision compared to previous generations, to major global clients. Hanmi Semiconductor’s MSVP equipment has maintained its position as the global market leader since the mid-2000s.
This equipment processes the entire semiconductor package precision cutting process, from washing, drying, to high-resolution 2D/3D vision inspection, quality selection, and automatic loading. The seventh generation introduces new unmanned automation technologies such as Blade Change Master, Auto Kit Change, and Full Self Device Setup, reducing operational management costs.
Additionally, the company will introduce the ‘TC Bonder 3.0CW,’ a 2.5D packaging bonder that attaches AI GPUs and HBM semiconductors to silicon interposers.
A company representative stated, “Singapore plays a crucial role in the global AI semiconductor supply chain, as evidenced by the groundbreaking of a new HBM packaging plant by U.S. semiconductor company Micron Technology in the Woodlands area earlier this year.” They added, “Through participating in SEMICON SEA, Hanmi Semiconductor plans to actively promote its advanced equipment technology in the Southeast Asian market and strengthen collaboration with local clients.”