SK Hynix: “Growing demand for HBM··· Customizing for customers starting from 7th generation HBM4E”

Lee Kang-wook, head of packaging development at SK Hynix, delivered a session at ‘Semicon Taiwan 2024’, “Lee Kang-wook, vice president of SK Hynix PKG (Packaging) Development, said on the 3rd, ‘Depending on the application product, the average adoption number that will be installed in training and inference artificial intelligence (AI) servers will increase as the high-bandwidth memory (HBM) generation advances’.”
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, “On this day, the vice president delivered a session on ‘HBM and Advanced Packaging Technology for the AI Era’ at ‘Semicon Taiwan 2024’ held in Taipei, Taiwan, revealing this information.”
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Lee Kang-wook, SK Hynix Vice President. [Photo courtesy of SK Hynix],
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, “The vice president explained, ‘HBM4 will be supplied in 12 and 16 layers, with a maximum capacity of up to 48GB. The data processing speed is expected to improve to over 1.65TB per second. From HBM4 onwards, we expect performance and energy efficiency improvement by applying logic processes to the base die. The base die is a core component that controls HBM.”
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, “The vice president forecasted that with the performance improvement of HBM, the demand for HBM will increase further. According to the industry, the HBM market is already expected to grow at an average annual rate of 109% from 2022 to 2025 amidst the projected 27% annual growth rate of the generative AI market until 2032.”
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, “SK Hynix plans to release the HBM4 12-layer product in the second half of next year. In particular, we will enhance product competitiveness through energy efficiency and heat dissipation using proprietary packaging technology.”
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, “The vice president said, ‘We plan to mass-produce the HBM4 12-layer product with ‘Advanced MR-MUF’. For the 16-layer product, we are preparing for both advanced MR-MUF and hybrid bonding methods, and we will choose the optimal method according to customer needs’.”
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, “Advanced MR-MUF is a technology that packages multiple semiconductor chips at once. Hybrid bonding is a technology that reduces the thickness of HBM while increasing speed. Recently, SK Hynix confirmed the possibility of applying advanced MR-MUF technology to 16-layer products.”
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, “The vice president said, ‘We are also preparing for the development of HBM4 and subsequent generation products to solve technological challenges in terms of bandwidth, capacity, and energy efficiency. From HBM4E (7th generation HBM) onwards, it is expected to have a strong custom nature, so we are strengthening cooperation with global partners from an ecosystem-building perspective’.”
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, “Meanwhile, Semicon Taiwan, which will be held from the 4th to the 6th, is Taiwan’s largest semiconductor industry exhibition where more than 1,000 global companies, including Taiwan’s leading companies like TSMC, in the foundry industry, will showcase semiconductor materials, equipment, and related technologies.”
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